DocumentCode
1639873
Title
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium
fYear
1997
Abstract
The following topics were dealt with. Computational modelling; analytical modelling; thermal management; heat sink characterization; and measurement methods
Keywords
heat sinks; integrated circuit packaging; multichip modules; plastic packaging; semiconductor device packaging; surface mount technology; thermal analysis; analytical modelling; computational modelling; cooling; heat sink characterization; measurement methods; packaging; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location
Austin, TX, USA
ISSN
1065-2221
Print_ISBN
0-7803-3793-X
Type
conf
DOI
10.1109/STHERM.1997.566775
Filename
566775
Link To Document