Title :
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium
Abstract :
The following topics were dealt with. Computational modelling; analytical modelling; thermal management; heat sink characterization; and measurement methods
Keywords :
heat sinks; integrated circuit packaging; multichip modules; plastic packaging; semiconductor device packaging; surface mount technology; thermal analysis; analytical modelling; computational modelling; cooling; heat sink characterization; measurement methods; packaging; thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-3793-X
DOI :
10.1109/STHERM.1997.566775
