DocumentCode :
1640092
Title :
Methodologies for supplier partnership and manufacturing implementation of continuous improvement projects
Author :
Tripathi, Sanjay ; Moghadam, Farhad
Author_Institution :
Technol. & Manuf. Group, Intel Corp., Santa Clara, CA, USA
fYear :
1994
Firstpage :
56
Lastpage :
58
Abstract :
With competition dictating early reduction in product prices, profits can only be enhanced by reducing manufacturing costs as quickly as possibly. This makes it imperative to implement all improvement projects into the manufacturing line with minimal delays. This paper describes how to manage the development and transfer of a new process/hardware set, while ensuring minimum impact to fab output, and while both development and manufacturing fabs are in the middle of an aggressive ramp. Incorporation of unit processes developed at vendor sites into semiconductor manufacturers has always been difficult. Process replication, parts availability, quality and delivery schedules, insufficient documentation and training, are just a few. We describe how we developed the partnership with our supplier to develop a sturdy process/hardware kit. Extensive beta-tests were first performed at the supplier site. Numerous process problems encountered during the beta-site at Intel were resolved with close interaction with the supplier. The development, manufacturing site and supplier worked jointly to proactively eliminate previous problems. The supplier implemented audits and process control of their suppliers´ processes, provided an experienced team to travel to both Santa Clara and Ireland for hardware start-up and trained Intel technicians. The improvements reduced the cost of ownership at a unit process by 60% due to an increased throughput of 18%, a 2× defect reduction and a 4× increase in the wafers that can be processed between PMs
Keywords :
economics; audits; continuous improvement projects; defect reduction; hardware start-up; manufacturing costs; parts availability; process control; process replication; supplier partnership; throughput; training; unit processes; Availability; Costs; Delay lines; Documentation; Hardware; Job shop scheduling; Manufacturing processes; Process control; Pulp manufacturing; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
Type :
conf
DOI :
10.1109/ASMC.1994.588186
Filename :
588186
Link To Document :
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