DocumentCode
1640132
Title
A new generalized state-space dynamic neural network method for I/O buffer modeling in high-speed PCB design
Author
Cao, Yi ; Bokhari, Syed
Author_Institution
Fidus Syst. Inc., Ottawa, ON, Canada
fYear
2010
Firstpage
1
Lastpage
4
Abstract
In this paper, we present a new method for modeling the nonlinear transient behavior of I/O buffers in high-speed PCB design. The proposed method expands the existing StateSpace Dynamic Neural Network (SSDNN) into a more generalized and efficient technique for modeling nonlinear behavior of I/O buffers. A Multi-Layer Perceptron (MLP) neural network with multiple hidden layers is combined with the SSDNN framework to further enhance the accuracy and flexibility of the trained neural network models. In addition, a new formulation embedding finite delay elements into the existing SSDNN is proposed to effectively address the modeling of such I/O devices where a long propagation delay is present. The proposed method is applied to the behavioral modeling of a commercial SSTL output buffer. It is demonstrated that the proposed method provides better accuracy compared to the existing SSDNN for modeling I/O buffers with strong nonlinearity and a long propagation delay, while outperforming the detailed SPICE model in terms of simulation efficiency.
Keywords
buffer circuits; circuit CAD; circuit analysis computing; multilayer perceptrons; printed circuit design; state-space methods; transient analysis; /O buffer modeling; SPICE model; SSTL output buffer; computer-aided design; formulation embedding finite delay elements; generalized state-space dynamic neural network method; high-speed PCB design; long propagation delay; multilayer perceptron neural network; nonlinear transient behavior modelling; Artificial neural networks; Computational modeling; Integrated circuit modeling; Microwave theory and techniques; Neurons; SPICE; Training; I/O buffers; behavioral modeling; computer-aided design; neural networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Antenna Technology and Applied Electromagnetics & the American Electromagnetics Conference (ANTEM-AMEREM), 2010 14th International Symposium on
Conference_Location
Ottawa, ON
Print_ISBN
978-1-4244-5049-7
Electronic_ISBN
978-1-4244-5050-3
Type
conf
DOI
10.1109/ANTEM.2010.5552487
Filename
5552487
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