DocumentCode :
164040
Title :
The effect of annealing in nitrogen atmosphere on the structure, photoluminescence and electrical properties of Li and Cu doped sol-gel ZnO films
Author :
Danciu, A. ; Mihalache, I. ; Danila, M. ; Bita, B. ; Plugaru, R.
Author_Institution :
Nat. Inst. for R&D in Microtechnol. (IMT), Bucharest, Romania
fYear :
2014
fDate :
13-15 Oct. 2014
Firstpage :
77
Lastpage :
80
Abstract :
The effect of annealing in air and in nitrogen atmosphere on the structure, luminescence emission and electrical properties of ZnO, Li:ZnO and Cu:ZnO doped thin films prepared by sol-gel method was investigated by scanning electron microscopy, X-ray diffraction, photoluminescence and resistivity measurements. The films annealed in nitrogen demonstrate smoother surfaces, improved crystallinity and conductivity. The residual stress in doped films changes from tensile type, when annealed in air, to compressive type in the case of annealing in nitrogen atmosphere. The effect is associated with the density of lattice defects in the films annealed in nitrogen.
Keywords :
II-VI semiconductors; X-ray diffraction; annealing; copper; crystal defects; electrical resistivity; internal stresses; lithium; photoluminescence; scanning electron microscopy; semiconductor doping; semiconductor thin films; sol-gel processing; wide band gap semiconductors; zinc compounds; X-ray diffraction; ZnO:Cu; ZnO:Li; annealing effect; crystallinity; doped thin films; electrical properties; lattice defects density; photoluminescence; residual stress; resistivity measurements; scanning electron microscopy; sol-gel method; structural properties; Annealing; Atmosphere; Films; Lattices; Nitrogen; Surface morphology; Zinc oxide; Cu doped ZnO; I-V characteristics; Li; photoluminescence; sol-gel; stress; structural parameters; thin films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference (CAS), 2014 International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4799-3916-9
Type :
conf
DOI :
10.1109/SMICND.2014.6966396
Filename :
6966396
Link To Document :
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