Title :
Thermal sub-modeling of the wirebonded plastic ball grid array package
Author :
Johnson, Zane ; Ramakrishna, K. ; Joiner, Bennett ; Eyman, Mike
Author_Institution :
Semicond. Product Sector, Motorola Inc., Austin, TX, USA
Abstract :
Numerical simulation of the steady-state thermal behavior of the plastic ball grid array (PBGA) package can be greatly eased through the use of appropriate thermal sub-models. Detailed heat conduction models are used to characterize the thermal constriction effects of the solder sphere array connecting the PBGA to the printed wiring board (PWB) and the thermal vias in the PBGA substrate. The results of the sub-models allow the use of more accurate, yet geometrically-simpler entities in a finite-element (FE) or control-volume simulation, thereby shortening the overall cycle time required for a given analysis. Thermal performance of a PBGA mounted on a standard thermal test board is simulated through FE and computational fluid dynamics (CFD) methods and compared to experimental data from 225- and 357-lead PBGAs
Keywords :
finite element analysis; heat conduction; lead bonding; plastic packaging; computational fluid dynamics; finite element simulation; heat conduction; numerical simulation; printed wiring board; solder sphere; thermal constriction; thermal sub-model; thermal via; wirebonded plastic ball grid array package; Computational fluid dynamics; Computational modeling; Electronics packaging; Iron; Joining processes; Numerical simulation; Plastic packaging; Steady-state; Thermal conductivity; Wiring;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1997. SEMI-THERM XIII., Thirteenth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3793-X
DOI :
10.1109/STHERM.1997.566777
