Acoustic wave sensing devices and their LTCC packaging

Author

Giangu, I. ; Buiculescu, V. ; Konstantinidis, G. ; Szacilowski, K. ; Stefanescu, A. ; Bechtold, F. ; Pilarczyk, K. ; Stavrinidis, A. ; Kwolek, P. ; Stavrinidis, G. ; Mech, J. ; Muller, A.

Author_Institution

Nat. Inst. for R&D in Microtechnol. (IMT), Bucharest, Romania

fYear

2014

fDate

13-15 Oct. 2014

Firstpage

147

Lastpage

150

Abstract

The paper presents the relevant results of manufacturing LTCC packages intended for chip assembly as well as the RF behavior of SAW and FBAR structures used as temperature and, respectively, humidity sensing devices. Packaged SAW-based temperature sensors were characterized in a cryostat set-up, while the packaged FBAR-based humidity sensors were measured in a small enclosure with controlled humidity. Linear behaviour of the frequency shift vs. temperature and, respectively, relative humidity was evidenced.

Keywords

bulk acoustic wave devices; ceramic packaging; humidity sensors; surface acoustic wave sensors; temperature sensors; LTCC packaging; SAW RF behavior; acoustic wave sensing device; chip assembly; cryostat set-up; film bulk acoustic wave; frequency shift; low temperature cofired ceramic packaging; packaged FBAR-based humidity sensor; packaged SAW-based temperature sensor; radiofrequency behavior; surface acoustic wave; Film bulk acoustic resonators; Humidity; Resonant frequency; Surface acoustic waves; Temperature measurement; Temperature sensors; FBAR resonator; LTCC package; SAW resonator; humidity sensor; temperature sensor;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference (CAS), 2014 International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4799-3916-9

Type

conf

DOI

10.1109/SMICND.2014.6966418

Filename

6966418