Title :
Acoustic wave sensing devices and their LTCC packaging
Author :
Giangu, I. ; Buiculescu, V. ; Konstantinidis, G. ; Szacilowski, K. ; Stefanescu, A. ; Bechtold, F. ; Pilarczyk, K. ; Stavrinidis, A. ; Kwolek, P. ; Stavrinidis, G. ; Mech, J. ; Muller, A.
Author_Institution :
Nat. Inst. for R&D in Microtechnol. (IMT), Bucharest, Romania
Abstract :
The paper presents the relevant results of manufacturing LTCC packages intended for chip assembly as well as the RF behavior of SAW and FBAR structures used as temperature and, respectively, humidity sensing devices. Packaged SAW-based temperature sensors were characterized in a cryostat set-up, while the packaged FBAR-based humidity sensors were measured in a small enclosure with controlled humidity. Linear behaviour of the frequency shift vs. temperature and, respectively, relative humidity was evidenced.
Keywords :
bulk acoustic wave devices; ceramic packaging; humidity sensors; surface acoustic wave sensors; temperature sensors; LTCC packaging; SAW RF behavior; acoustic wave sensing device; chip assembly; cryostat set-up; film bulk acoustic wave; frequency shift; low temperature cofired ceramic packaging; packaged FBAR-based humidity sensor; packaged SAW-based temperature sensor; radiofrequency behavior; surface acoustic wave; Film bulk acoustic resonators; Humidity; Resonant frequency; Surface acoustic waves; Temperature measurement; Temperature sensors; FBAR resonator; LTCC package; SAW resonator; humidity sensor; temperature sensor;
Conference_Titel :
Semiconductor Conference (CAS), 2014 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4799-3916-9
DOI :
10.1109/SMICND.2014.6966418
