DocumentCode :
164084
Title :
Manufacturing of capacitive electrodes on Si-substrate for electrophysiological applications
Author :
Ravariu, C. ; Babarada, F. ; Manea, E. ; Parvulescu, C. ; Rusu, Irena ; Enache, I. ; Cristea, M. ; Arhip, J.
Author_Institution :
Fac. of Electron., Politeh. Univ. of Bucharest, Bucharest, Romania
fYear :
2014
fDate :
13-15 Oct. 2014
Firstpage :
151
Lastpage :
154
Abstract :
The usual electrodes from electrophysiology are resistive. A variable metal-skin contact resistance frequently generates unpleasant artifacts. The capacitive electrodes avoid this disadvantage and are suitable for variable biosignals recording. The main novelty of this paper is the manufacturing of capacitive electrodes with all terminals on the top surface, letting free the electrode bottom for physiological preparations. So, the paper firstly presents the TCAD techniques used for the design of some capacitive electrode using three mask levels. By EDA, L-EDIT tools, the layers that constitute the fabrication masks are transferred to the glass support. In the last part, the electrodes technological flow design and testing in a real electrophysiological platform using the capacitive electrodes, are presented.
Keywords :
bioelectric phenomena; biomedical electrodes; glass; metals; silicon; skin; substrates; EDA; L-EDIT tools; Si-substrate; TCAD techniques; artifacts; biosignal recording; capacitive electrode manufacturing; electrode bottom; electrode technological flow design; electrophysiological applications; electrophysiological platform; electrophysiology; fabrication masks; glass support; physiological preparations; top surface terminals; variable metal-skin contact resistance; Capacitance; Electrodes; Metals; Robot sensing systems; Silicon; Skin; Substrates; L-Edit; TiPt; capacitive electrodes; electrophysiological applications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference (CAS), 2014 International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4799-3916-9
Type :
conf
DOI :
10.1109/SMICND.2014.6966419
Filename :
6966419
Link To Document :
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