• DocumentCode
    1641367
  • Title

    The relationship between ground and EMI

  • Author

    Peng, Zhang ; Li Shufang

  • Author_Institution
    Beijing Univ. of Posts & Telecommun.
  • Volume
    1
  • fYear
    2005
  • Firstpage
    662
  • Abstract
    Ground is an important concept in the PCB design. It provides return current path for both power and signal. Improperly grounding may cause EMI problem in PCB design. High impedance returns path brings the increment of EMI. Today, electronics engineers meet with the problems that the size of the PCB is getting smaller and smaller so that large area grounding has become a challenge to them. This paper focuses on the simulation of high-speed transmission line´s grounding, illustrating the EMI due to improperly grounding. And after that, some methods are promoted to reduce EMI
  • Keywords
    earthing; electromagnetic interference; printed circuit design; EMI; PCB design; high-speed transmission lines grounding; Circuit simulation; Electromagnetic interference; Electronics industry; Frequency; Grounding; Impedance; Inductance; Industrial electronics; Parasitic capacitance; Wire; EMI; Grounding; PCB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2005. MAPE 2005. IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-9128-4
  • Type

    conf

  • DOI
    10.1109/MAPE.2005.1617997
  • Filename
    1617997