Title :
Packaging and board assembly technology trend and impact on the supply chain
Author :
Shangguan, Dongkai
Author_Institution :
Flextronics, San Jose, CA, USA
Abstract :
The development and implementation of packaging and assembly technologies to enable continued miniaturization, functional densification and integration, as well as environmental friendliness, have specific and direct impact on the supply chain, including packaging, board assembly materials, processes and equipment. Fast time-to-market requirement, in combination with low cost and high reliability needs for different product categories, demands ever increasing cooperation throughout the supply chain, with early visibility.
Keywords :
packaging; printed circuit manufacture; supply chain management; board assembly technology; environmental friendliness; functional densification; functional integration; miniaturization; packaging technology; product categories; product packaging; supply chain; time-to-market requirement; Assembly; Costs; Electronics packaging; Logic testing; Packaging machines; Printers; Printing; Supply chains; Surface-mount technology; Time to market;
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
DOI :
10.1109/HPD.2004.1346664