DocumentCode :
1641808
Title :
Predictive modeling of capacitance and resistance in gate-all-around cylindrical nanowire MOSFETs for parasitic design optimization
Author :
Xu, Qiumin ; Zou, Jibin ; Luo, Jieyin ; Wang, Runsheng ; Huang, Ru
Author_Institution :
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
fYear :
2010
Firstpage :
1958
Lastpage :
1960
Abstract :
This paper presents a predictive electrostatic capacitance and resistance compact model of multiple gate MOSFET with cylindrical conducting channels, taking into account parasitic effects, quantum confinement and quasi-ballistic effects. The model incorporates the dependence of channel length, gate height and width, gate-to-contact spacing, nanowire size, multiple channels, as well as 1-D ultra-narrow source/drain extension (SDE) doping profile. The proposed non-iterative electrostatic model is successfully verified, and can be used to predict nanowire-based circuit performance. Based on the analytical model, we can further examine which parasitic components are affecting the delay. Results revealed that Cside, Cof, Rsd, RQ are dominant factors and should be treated as a major design concern. Among all the parameters, Lsd, Tg and Ndop are essentially important in parasitic design optimization. By selectively modifying these parameters, parasitic effect is evidently reduced.
Keywords :
MOSFET; doping profiles; electrostatics; nanowires; optimisation; semiconductor device models; cylindrical conducting channels; cylindrical nanowire MOSFET; doping profile; multiple gate MOSFET; noniterative electrostatic model; parasitic design optimization; predictive electrostatic capacitance; predictive electrostatic resistance; quantum confinement; quasiballistic effects; source/drain extension; Analytical models; Delay; Logic gates; Quantum capacitance; Resistance; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-5797-7
Type :
conf
DOI :
10.1109/ICSICT.2010.5667822
Filename :
5667822
Link To Document :
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