Prediction of stand-off height and 3D shape of solder joint in fiber attachment soldering

Author

Wei, Zhang ; Chunqing, Wang

Author_Institution

State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China

fYear

2004

Firstpage

151

Lastpage

153

Abstract

The 3D shape of solder joint in fiber attachment soldering was predicted by employing finite element method (FEM). Based on the minimum potential energy theorem and data from shape simulation, the influence of material and manufacturing parameters on the stand-off height (SOH) between optical fiber and substrate was analyzed in detail. The results showed that the z-axis alignment of optical fiber can be controlled by solder volume and solder joint design.

Keywords

finite element analysis; optical fibres; soldering; substrates; 3D solder joint shape; fiber attachment soldering; finite element method; manufacturing parameters; material parameters; minimum potential energy theorem; optical fiber; shape simulation; solder joint design; solder volume; stand-off height prediction; substrate; z-axis alignment; Analytical models; Finite element methods; Optical control; Optical design; Optical fibers; Optical materials; Potential energy; Shape; Soldering; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Print_ISBN

0-7803-8620-5

Type

conf

DOI

10.1109/HPD.2004.1346689

Filename

1346689