Integrated MEMS technology

For developing the integrated low-loss MEMS, the number of the optical-electrical micro-transducers must be arrayed to the optimum for controlling, high photoelectric conversion efficiency is also necessary, then the high rate data source will arrive at its destination with high signal-to-noise ratio (SNR), the optical micro-units (in micro-arrays) can be located to the maximum. To guarantee the reliability and the stability of running, the package technology is critical. The vector adaptive finding technology (VAF) with the segmented stage packaging technology (SSP) can satisfy the requirements. The extended vector adaptive finding (EVAF) can supply wireless services well, the simple vector adaptive finding (SVAF) is low-cost to implement.