DocumentCode :
1642615
Title :
Conductivity improvement of isotropically conductive adhesives
Author :
Li, Yi ; Moon, Kyoung-Sik ; Li, Haiying ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2004
Firstpage :
236
Lastpage :
241
Abstract :
To further increase the conductivity of isotropically conductive adhesives, short-chain dicarboxylic acids, such as malonic acid (acid M), adipic acid (acid A) and terephthalic acid (acid T), were introduced in a typical ICA formulation. By partially removing or replacing the surfactant stearic acid in silver (Ag) flakes, such dicarboxylic acids have potential to increase the conductivity of ECAs. With the addition of malonic acid and adipic acid, which only have short single-bond chain hydrocarbon between the dicarboxylic groups, the conductivity of the typical conductive adhesives were improved significantly. Terephthalic acid, however, deteriorates the conductivity due to the rigid aromatic structure in the molecule. Dynamic mechanical analysis and thermomechanical study indicated the improved electrical properties with malonic and adipic acids were achieved without negatively affecting the mechanical and physical properties of ECAs.
Keywords :
adhesives; electrical conductivity; polymers; thermomechanical treatment; ECA conductivity increase; ICA formulation; adipic acid; conductivity improvement; dynamic mechanical analysis; electrical property improvement; isotropically conductive adhesives; malonic acid; mechanical properties; physical properties; rigid aromatic molecule structure; short-chain dicarboxylic acids; silver flakes; single-bond chain hydrocarbon; surfactant stearic acid removal; terephthalic acid; thermomechanical study; Chemical technology; Conductive adhesives; Conductivity; Costs; Independent component analysis; Materials science and technology; Mechanical factors; Resins; Silver; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN :
0-7803-8620-5
Type :
conf
DOI :
10.1109/HPD.2004.1346705
Filename :
1346705
Link To Document :
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