DocumentCode
1642708
Title
Highly manufacturable 1T1C 4 Mb FRAM with novel sensing scheme
Author
Jung, D.J. ; Jeon, B.G. ; Kim, H.H. ; Song, Y.J. ; Koo, B.J. ; Lee, S.Y. ; Park, S.O. ; Park, Y.W. ; Kinam Kim
Author_Institution
Technol. Dept., Samsung Electron. Co., Kyungki, South Korea
fYear
1999
Firstpage
279
Lastpage
282
Abstract
A novel sensing scheme using a gate-oxide reference cell is developed for achieving high yield of 1T1C FRAM. The sensing scheme generates highly uniform and fatigue-free reference level, and thus provides a reliable sensing margin. A novel technology to evaluate charge distribution of all memory cells is used for identifying the root causes of bit failure which are most critical factor for yield loss. Using this technology, hydrogen damage and etching damage are found to be the major loss factors. By eliminating the etch-damage with wet treatment and by using robust hydrogen-barrier, a wide sensing window, /spl Delta/Qref=74 fC, was achieved for highly manufacturable FRAM.
Keywords
ferroelectric storage; random-access storage; 1T1C FRAM; 4 Mbit; bit failure; charge distribution; etching damage; gate oxide reference cell; hydrogen barrier; hydrogen damage; manufacture; memory cell; sensing technique; wet treatment; yield loss; Capacitors; Ferroelectric films; Ferroelectric materials; Hydrogen; Manufacturing; Nonvolatile memory; Pulse measurements; Random access memory; Robustness; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-5410-9
Type
conf
DOI
10.1109/IEDM.1999.824151
Filename
824151
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