Wafer-level technology for sub-mm wave focal plane arrays

A robust and compact scheme for building Submm-wave array receivers will be presented in this paper. By utilizing wafer-level integration the scheme enables compact multi-pixel modules. Bulk Silicon Deep Reactive Ion Etching techniques are used to build waveguides that allow the RF signals to be routed in the third dimension. Finally, a novel micro-lens antenna has been designed; fabricated and characterized that allows the antenna array to be fabricated via standard photolithography thus making it possible to build a beam-forming array. Preliminary work has focused on demonstrating a single pixel 500-600 GHz receiver front end and the characterization of the micro-lens.