Heat transfer analyses of molten droplet solder bumping for electronic interconnection

Author

Fuquan Lia ; Wang, Chunqing ; Zhao, Zhenqing ; Liu, Peter ; Deming Liu

Author_Institution

State Key Lab of Adv. Welding Production Technol., Harbin Inst. of Technol., China

fYear

2004

Firstpage

336

Lastpage

340

Abstract

Molten droplet solder bumping as a new type bumping method is developed in recent years. In this paper, the basic process and phenomenon of this method was investigated. The interfacial reaction between 63Sn37Pb droplet and Au/Ni/Cu pad was analyzed by SEM, that morphology of intermetallic compounds at interface is strongly influenced by initial temperature of solder ball. Results of the have shown: initial temperature of solder ball was the main factor for bump fabrication. The pad temperature field was analyzed using finite element method (FEM).

Keywords

finite element analysis; heat transfer; integrated circuit interconnections; integrated circuit packaging; solders; surface morphology; 63Sn37Pb droplet; Au-Ni-Cu; Au/Ni/Cu pad; SEM; SnPb; bump fabrication; bumping method; contact temperature; electronic interconnection; finite element method; heat transfer analyses; intermetallic compounds; pad temperature field; solder ball; solder bumping; Chemical analysis; Costs; Electronics packaging; Fabrication; Gold; Heat transfer; Intermetallic; Morphology; Production; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on

Print_ISBN

0-7803-8620-5

Type

conf

DOI

10.1109/HPD.2004.1346723

Filename

1346723