Low energy plasma chemical reactor with coaxial magnetic field for precision etching of elements with submicron size

Summary form only given, as follows. We have created a plasma chemical reactor with the operating axial-symmetric magnetic field. We have the possibility of checking in main working regime the energy of ions from 20 eV to 200 eV. The absence in a chemical active plasma of ions with energy >200 eV allows etching of different materials and thin films of micron and submicron sizes without defects.