DocumentCode
1643645
Title
Current and future trends in microcontamination research
Author
Blewer, Robert S.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
1994
Firstpage
83
Lastpage
86
Abstract
Because contamination can fatally flaw any process step in integrated circuit manufacture, contamination control is critically important to the yield and reliability of increasingly complex semiconductor devices. As industry strives to keep pace with rapidly shrinking feature sizes and as chip areas approach two square inches within the next ten years, stronger emphasis must be placed on contamination issues to achieve acceptable yields. The most critical research needs and requirements in contamination free manufacturing (CFM), as highlighted by the National Semiconductor Roadmap for Semiconductors, will be considered in this paper, with details and suggestions about seven important areas for research. A discussion of selected active CFM research activities and results are included, together with a list of several areas where additional research efforts should be initiated to meet future CFM Research Roadmap requirements
Keywords
integrated circuit yield; CFM Research Roadmap; National Semiconductor Roadmap for Semiconductors; contamination control; contamination free manufacturing; integrated circuit manufacture; microcontamination; reliability; semiconductor devices; yield; Adhesives; Inductors; Manufacturing industries; Plasma devices; Plasma materials processing; Plasma sources; Pulse measurements; Semiconductor device manufacture; Surface cleaning; Surface contamination;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-2053-0
Type
conf
DOI
10.1109/ASMC.1994.588200
Filename
588200
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