• DocumentCode
    1643645
  • Title

    Current and future trends in microcontamination research

  • Author

    Blewer, Robert S.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    1994
  • Firstpage
    83
  • Lastpage
    86
  • Abstract
    Because contamination can fatally flaw any process step in integrated circuit manufacture, contamination control is critically important to the yield and reliability of increasingly complex semiconductor devices. As industry strives to keep pace with rapidly shrinking feature sizes and as chip areas approach two square inches within the next ten years, stronger emphasis must be placed on contamination issues to achieve acceptable yields. The most critical research needs and requirements in contamination free manufacturing (CFM), as highlighted by the National Semiconductor Roadmap for Semiconductors, will be considered in this paper, with details and suggestions about seven important areas for research. A discussion of selected active CFM research activities and results are included, together with a list of several areas where additional research efforts should be initiated to meet future CFM Research Roadmap requirements
  • Keywords
    integrated circuit yield; CFM Research Roadmap; National Semiconductor Roadmap for Semiconductors; contamination control; contamination free manufacturing; integrated circuit manufacture; microcontamination; reliability; semiconductor devices; yield; Adhesives; Inductors; Manufacturing industries; Plasma devices; Plasma materials processing; Plasma sources; Pulse measurements; Semiconductor device manufacture; Surface cleaning; Surface contamination;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-2053-0
  • Type

    conf

  • DOI
    10.1109/ASMC.1994.588200
  • Filename
    588200