DocumentCode
1644022
Title
A new substrate engineering for the formation of empty space in silicon (ESS) induced by silicon surface migration
Author
Sato, T. ; Aoki, N. ; Mizushima, I. ; Tsunashima, Y.
Author_Institution
Microelectron. Eng. Lab., Toshiba Corp., Yokohama, Japan
fYear
1999
Firstpage
517
Lastpage
520
Abstract
A new technique to form empty spaces in silicon substrates is presented. The empty space with various shapes, such as plate as well as sphere and pipe, could be formed under the surface of the silicon substrate.
Keywords
elemental semiconductors; silicon; substrates; Si; empty space in silicon; silicon substrate; silicon surface migration; substrate engineering; Air gaps; Annealing; Electronic switching systems; Laboratories; Lattices; MOS devices; Microelectronics; Shape; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-5410-9
Type
conf
DOI
10.1109/IEDM.1999.824206
Filename
824206
Link To Document