DocumentCode
1644037
Title
Design of an automatic lead inspection system: an integrated application of machine vision and robotics
Author
Chen, Hwa-Shing ; Chu, Lon-Hai ; Ito, Carl T. ; Ofman, Leo ; Roy, Douglas C. ; Srinivasan, Srini
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1988
Firstpage
221
Lastpage
232
Abstract
The development and design are described of a machine-vision-based lead-inspection system used in the semiconductor assembly process and completely developed and integrated by the Factory Automation Group at Intel Corporation. The motivation behind the project is discussed, as are design considerations, features of major components, and how state-of-the-art vision and robot technologies are integrated to provide a total system solution. A flexible lead-inspection system has been in production since the beginning of 1987 and has inspected over one million plastic leaded chip carrier packages. The system´s performance indicators have either met or exceeded engineering expectations. The part manipulation and vision subsystems support a three-second cycle per part. Speed and consistency are superior to manual inspection using comparators. The system is often used as a standard in bringing up other dedicated inspection equipment.<>
Keywords
computer vision; industrial robots; inspection; 3 s; Factory Automation Group; Intel; automatic lead inspection system; consistency; dedicated inspection equipment; design considerations; features of major components; flexible lead-inspection system; integrated machine vision and robotics; machine-vision-based lead-inspection system; motivation; optical inspection; part manipulation; plastic leaded chip carrier packages; robot technologies; semiconductor assembly process; three-second cycle; vision subsystems; Assembly systems; Inspection; Lead compounds; Manufacturing automation; Packaging machines; Plastic packaging; Production systems; Robot vision systems; Robotic assembly; Robotics and automation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location
Lake Buena Vista, FL, USA
Type
conf
DOI
10.1109/EMTS.1988.16181
Filename
16181
Link To Document