• DocumentCode
    1644037
  • Title

    Design of an automatic lead inspection system: an integrated application of machine vision and robotics

  • Author

    Chen, Hwa-Shing ; Chu, Lon-Hai ; Ito, Carl T. ; Ofman, Leo ; Roy, Douglas C. ; Srinivasan, Srini

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    1988
  • Firstpage
    221
  • Lastpage
    232
  • Abstract
    The development and design are described of a machine-vision-based lead-inspection system used in the semiconductor assembly process and completely developed and integrated by the Factory Automation Group at Intel Corporation. The motivation behind the project is discussed, as are design considerations, features of major components, and how state-of-the-art vision and robot technologies are integrated to provide a total system solution. A flexible lead-inspection system has been in production since the beginning of 1987 and has inspected over one million plastic leaded chip carrier packages. The system´s performance indicators have either met or exceeded engineering expectations. The part manipulation and vision subsystems support a three-second cycle per part. Speed and consistency are superior to manual inspection using comparators. The system is often used as a standard in bringing up other dedicated inspection equipment.<>
  • Keywords
    computer vision; industrial robots; inspection; 3 s; Factory Automation Group; Intel; automatic lead inspection system; consistency; dedicated inspection equipment; design considerations; features of major components; flexible lead-inspection system; integrated machine vision and robotics; machine-vision-based lead-inspection system; motivation; optical inspection; part manipulation; plastic leaded chip carrier packages; robot technologies; semiconductor assembly process; three-second cycle; vision subsystems; Assembly systems; Inspection; Lead compounds; Manufacturing automation; Packaging machines; Plastic packaging; Production systems; Robot vision systems; Robotic assembly; Robotics and automation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
  • Conference_Location
    Lake Buena Vista, FL, USA
  • Type

    conf

  • DOI
    10.1109/EMTS.1988.16181
  • Filename
    16181