• DocumentCode
    1644334
  • Title

    SiGe profile design tradeoffs for RF circuit applications

  • Author

    Guofu Niu ; Shiming Zhang ; Cressler, J.D. ; Joseph, A.J. ; Fairbanks, J.S. ; Larson, L.E. ; Webster, C.S. ; Ansley, W.E. ; Harame, D.L.

  • Author_Institution
    Alabama Microelectron. Sci. & Technol. Center, Auburn Univ., AL, USA
  • fYear
    1999
  • Firstpage
    573
  • Lastpage
    576
  • Abstract
    We present the first experimental results for new SiGe profile designs which were developed explicitly for improving minimum noise figure (NF/sub min/) without sacrificing gain, linearity, frequency response, or the stability of the SiGe strained layer. A measured NF/sub min/ of 0.2 dB at 2.0 GHz with an associated gain (G/sub assoc/) of 13 dB at noise matching, and a linearity efficiency (OIP3/P/sub DC/) of 10 were obtained for the best low-noise profile, all of which represent substantial improvements in RF performance over the Si BJT and control SiGe HBT design point, and were accomplished without sacrificing SiGe film stability. The fundamental SiGe profile design tradeoffs associated with emerging SiGe RF circuit applications are discussed.
  • Keywords
    CVD coatings; Ge-Si alloys; S-parameters; doping profiles; frequency response; heterojunction bipolar transistors; microwave bipolar transistors; semiconductor device noise; semiconductor materials; 0.2 dB; 0.5 mum; 13 dB; 2 to 40 GHz; HBT; RF circuit applications; RF performance; S-parameters; SiGe; SiGe film stability; SiGe profile design tradeoffs; SiGe strained layer stability; UHV/CVD growth; Y-parameters; collector current; frequency response; gain; linearity efficiency; low-noise profile; minimum noise figure; noise matching; Circuit stability; Frequency response; Gain measurement; Germanium silicon alloys; Linearity; Noise figure; Noise measurement; Performance gain; Radio frequency; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-5410-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1999.824219
  • Filename
    824219