Title :
SOC power off - power noise analysis
Author_Institution :
Intel Corp., Bayan Lepas, Malaysia
Abstract :
Advancing to sub-micron processes, power gating using MTCMOS has been widely adopted in complex SOC to reduce the leakage current. Increasing computing applications especially mobile and wireless chip designs require extensive power gating design to power on and off modules in designs. The power signature goes hand-in-hand with the end-product usage model. Even though power gating helps to reduce the leakage, it generates significant power noise which affects chip functional stability. This paper focuses on the analysis of power noise caused by power off operation. It describes the noise coupling at both the system and the die levels in section II. The power-off circuit modeling will be explained in section III. A comparison of silicon measurement result to spice simulation as well as a prominent power noise EDA tool are presented in section IV.
Keywords :
CMOS integrated circuits; SPICE; electronic design automation; integrated circuit modelling; leakage currents; system-on-chip; EDA tool; MTCMOS; SOC power off; leakage current; noise coupling; power gating; power noise analysis; power-off circuit modeling; silicon measurement; spice simulation; sub-micron process; wireless chip designs; Chip scale packaging; Circuit noise; Circuit stability; Computer applications; Leakage current; Mobile computing; Noise generators; Noise reduction; Power generation; Power system modeling;
Conference_Titel :
SoC Design Conference (ISOCC), 2009 International
Conference_Location :
Busan
Print_ISBN :
978-1-4244-5034-3
Electronic_ISBN :
978-1-4244-5035-0
DOI :
10.1109/SOCDC.2009.5423814