• DocumentCode
    1644506
  • Title

    3D graphics cache system to maximize memory utilization for an embedded system

  • Author

    Chung, Youngjin ; Lee, Kilwhan ; Lee, Jinaeon ; Lee, Yongsurk

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2009
  • Firstpage
    573
  • Lastpage
    576
  • Abstract
    In this paper, we introduce 3D graphics cache system to increase memory utilization and solve a memory bottleneck problem for an embedded system. We propose a novel pixel cache and a texture cache for a mobile 3D graphics hardware accelerator. The pixel cache enhances rendering performance by adopting a new write back algorithm and the texture cache also enhances the performance by adopting a multi-level, multi-port and non-blocking architecture. And all caches are optimized for AMBA3.0 AXI on-chip bus protocol. Also the proposed cache architecture can alleviate the memory bottleneck problem by preventing intensive memory accesses and improving cache efficiency by implementing novel cache architectures and multiple outstanding transactions. Also we can reduce a peak power which is a critical problem for an embedded system. We have evaluated the new proposed caches on 3D graphics IP on a SOC environment in where various IPs are embedded. The simulation results show the effectiveness of the proposed methods.
  • Keywords
    cache storage; computer graphics; embedded systems; system-on-chip; 3D graphics cache system; AMBA3.0 AXI on-chip bus protocol; SOC environment; embedded system; memory bottleneck problem; memory utilization; mobile 3D graphics hardware accelerator; pixel cache; texture cache; write back algorithm; Bandwidth; Degradation; Embedded system; Graphics; Hardware; Interleaved codes; Large scale integration; Out of order; System buses; System-on-a-chip; 3d graphics; SoC; memory bottleneck; pixel cache; texture cache multiple outstanding issue;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoC Design Conference (ISOCC), 2009 International
  • Conference_Location
    Busan
  • Print_ISBN
    978-1-4244-5034-3
  • Electronic_ISBN
    978-1-4244-5035-0
  • Type

    conf

  • DOI
    10.1109/SOCDC.2009.5423818
  • Filename
    5423818