• DocumentCode
    1644862
  • Title

    Polysilicon gate with depletion-or-metallic gate with buried channel: what evil worse ?

  • Author

    Josse, E. ; Skotnicki, T.

  • Author_Institution
    CNET, Grenoble, France
  • fYear
    1999
  • Firstpage
    661
  • Lastpage
    664
  • Abstract
    Metallic gates are expected to overcome polysilicon´s limitations, such as polydepletion. Nevertheless, this option must be associated with buried channel to ensure low V/sub TH/ operation. Taking into account realistic projections on technological capabilities, such as active gate doping, oxide thickness or junction depth, we confirm that the degradation in performances due to the buried channel is definitively much more restrictive than that relative to the polydepletion.
  • Keywords
    MOSFET; buried layers; semiconductor device metallisation; MOSFET; Si; active gate doping; buried channel; junction depth; metallic gate; oxide thickness; polysilicon gate depletion; Boron; Capacitance; Costs; Couplings; Data mining; Degradation; Doping; MOS devices; MOSFETs; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-5410-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1999.824239
  • Filename
    824239