DocumentCode
1644862
Title
Polysilicon gate with depletion-or-metallic gate with buried channel: what evil worse ?
Author
Josse, E. ; Skotnicki, T.
Author_Institution
CNET, Grenoble, France
fYear
1999
Firstpage
661
Lastpage
664
Abstract
Metallic gates are expected to overcome polysilicon´s limitations, such as polydepletion. Nevertheless, this option must be associated with buried channel to ensure low V/sub TH/ operation. Taking into account realistic projections on technological capabilities, such as active gate doping, oxide thickness or junction depth, we confirm that the degradation in performances due to the buried channel is definitively much more restrictive than that relative to the polydepletion.
Keywords
MOSFET; buried layers; semiconductor device metallisation; MOSFET; Si; active gate doping; buried channel; junction depth; metallic gate; oxide thickness; polysilicon gate depletion; Boron; Capacitance; Costs; Couplings; Data mining; Degradation; Doping; MOS devices; MOSFETs; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1999. IEDM '99. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-5410-9
Type
conf
DOI
10.1109/IEDM.1999.824239
Filename
824239
Link To Document