DocumentCode
1645662
Title
The Physics of Reliability for High Voltage AlGaN/GaN HFET´s
Author
Trew, R.J. ; Liu, Y. ; Kuang, W.W. ; Bilbro, G.L.
Author_Institution
Dept. of ECE, North Carolina State Univ., Raleigh, NC
fYear
2006
Firstpage
103
Lastpage
106
Abstract
High voltage HFET´s fabricated from nitride semiconductors utilizing the AlGaN/GaN heterojunction demonstrate excellent RF performance with RF output power greater than an order of magnitude higher than available from GaAs and InP based devices. However, the nitride devices demonstrate a reliability problem where the dc current and RF output power continually decrease as a function of time. The reliability problem is related to the conduction characteristics of the gate electrode and an electron tunneling mechanism where electrons leak from the gate to the surface of the semiconductor. In this work the physics responsible for this behavior are investigated and described
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; gallium compounds; indium compounds; power HEMT; semiconductor device reliability; wide band gap semiconductors; AlGaN-GaN; HFET gate leakage; HFET reliability; RF performance; electron tunneling; gate electrode; heterojunction; high voltage HFET; nitride semiconductors; Aluminum gallium nitride; Electrons; Gallium nitride; HEMTs; Heterojunctions; MODFETs; Physics; Power generation; Radio frequency; Voltage; AlGaN/GaN HFET reliability; HFET gate leakage; High voltage FET reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuit Symposium, 2006. CSIC 2006. IEEE
Conference_Location
San Antonio, TX
Print_ISBN
1-4244-0126-7
Electronic_ISBN
1-4244-0127-5
Type
conf
DOI
10.1109/CSICS.2006.319925
Filename
4109991
Link To Document