Title :
Signal Integrity verification of Coplanar Structures for shielded on-chip interconnect lines
Author :
Khan, Zafar Bedar ; Kim, Hyewon ; Eo, Yungseon
Author_Institution :
Dept. of Electr. & Comput. Eng., Hanyang Univ., Ansan, South Korea
Abstract :
This paper analyses and compares two coplanar structures to be employed as shielded structures for on-chip critical interconnect lines such as clock. It is believed that at lower bit rates, on-chip area overhead caused by the ground-signal-ground structure can be mitigated by a coplanar power-signal-ground structure, if the performance of the two is not much different. However at higher bit rates, in addition to area saving, the later structure is shown to be better performance wise.
Keywords :
clocks; coplanar waveguides; integrated circuit interconnections; clock; coplanar structures; on-chip area overhead; shielded on-chip interconnect lines; shielded structures; signal integrity verification; Bit rate; Clocks; Conductivity; Coplanar transmission lines; Coplanar waveguides; Copper; Frequency; Integrated circuit interconnections; Parameter extraction; Power transmission lines; Coplanar Waveguide; Signal Integrity; Transmission lines;
Conference_Titel :
SoC Design Conference (ISOCC), 2009 International
Conference_Location :
Busan
Print_ISBN :
978-1-4244-5034-3
Electronic_ISBN :
978-1-4244-5035-0
DOI :
10.1109/SOCDC.2009.5423861