DocumentCode :
164587
Title :
Modeling and prediction of conducted EMI noise in a 2-stage interleaved boost DC/DC converter
Author :
Tahavorgar, Amir ; Quaicoe, John E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Memorial Univ. of Newfoundland, St. John´s, NL, Canada
fYear :
2014
fDate :
25-28 May 2014
Firstpage :
117
Lastpage :
121
Abstract :
Conducted electromagnetic interference (EMI) noise for a 2-stage interleaved DC/DC boost converter is investigated in this paper. Both differential mode (DM) noise and common mode (CM) noise are studied, taking into account all parasitic components. Using frequency domain approach, a noise prediction model for the interleaved topology is developed. The results from the model are compared with those of the non-interleaved topology to characterize the conducted EMI noise caused by doubling the number of high frequency power switches and switching frequency reduction in the interleaved topology. It is shown that the magnitude of the DM and CM noise in the interleaved topology is less than in the non-interleaved topology, especially at high frequencies in the spectrum of the conducted noise.
Keywords :
DC-DC power convertors; electromagnetic interference; switches; topology; 2-stage interleaved boost DC-DC converter; common mode noise; conducted EMI noise modeling; conducted EMI noise prediction; conducted electromagnetic interference noise; differential mode noise; frequency domain approach; high frequency power switches; interleaved topology; parasitic components; switching frequency reduction; Electromagnetic interference; Inductors; Noise; Noise level; Switches; Switching frequency; Topology; Boost DC/DC converter; common mode (CM) noise; differential mode (DM) noise; electromagnetic interference (EMI); interleaved topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Harmonics and Quality of Power (ICHQP), 2014 IEEE 16th International Conference on
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/ICHQP.2014.6842814
Filename :
6842814
Link To Document :
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