• DocumentCode
    1646037
  • Title

    Dynamic compact thermal model for smart electro-thermal simulation: Application to automotive power device

  • Author

    Azoui, T. ; Tounsi, P. ; Dupuy, Ph ; Dorkel, J.-M.

  • Author_Institution
    LAAS, CNRS, Toulouse, France
  • fYear
    2010
  • Firstpage
    265
  • Lastpage
    268
  • Abstract
    This paper presents a new and innovative methodology for power components manufacturers to generate accurate boundary condition independent dynamic Compact Thermal Models (“BCI” DCTMs). The originality of this methodology summarized by: taking into account of the thermal behavior of electronic components containing several cooling surfaces, and representing the non-linear properties of materials, while keeping a simple and recurring structure of generated models. Moreover, the dependence of dissipated power on temperature is considered. The proposed method makes it possible to obtain DCTMs with a limited number of measurements or 3D thermal simulations. The methodology to build the DCTM is based on the extraction of equivalent thermal RC network. The precision of the RC thermal network is improved by using variable resistances and capacitances related to the heat fluxes so that the compact model can adapt its parameters automatically with boundary conditions.
  • Keywords
    automotive electronics; cooling; power semiconductor devices; semiconductor device models; 3D thermal simulations; automotive power device; boundary condition independent dynamic compact thermal models; electronic components; equivalent thermal RC network extraction; heat fluxes; power components manufacturers; smart electro-thermal simulation; Boundary conditions; Capacitance; Mathematical model; Solid modeling; Surface impedance; Temperature dependence; Thermal resistance; Dynamic compact thermal model (DCTM); RC thermal networks; VHDL-AMS; boundary condition independent (BCI); power devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2010 IEEE
  • Conference_Location
    Austin, TX
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4244-8578-9
  • Type

    conf

  • DOI
    10.1109/BIPOL.2010.5667985
  • Filename
    5667985