Title :
Electromagnetic Characterization Analysis of the Connecting Structure of the Via in Multilayered Microwave Circuit
Author :
Xuanwei, Cai ; Yu, Tian ; Ling, Tong
Author_Institution :
Coll. of Autom., UESTC, Chengdu
Abstract :
Via hole is frequently applied in multilayer microwave circuit interconnection. As the discontinuity of via, it causes more reflection and radiation when frequency becomes higher. Therefore, electromagnetic characterization analysis of via is important in the design of microwave circuit. The paper presents the electromagnetic modeling method of via based on the principle of microwave network in multilayer microwave circuit. To achieve the simplification, the authors decompose the overall structure into several substructures, then, Matrix-Penciled Moment Method and microwave network theory are used to analyze each substructure.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit modelling; matrix algebra; method of moments; microwave integrated circuits; electromagnetic characterization analysis; electromagnetic modeling method; matrix-penciled moment method; microwave circuit design; microwave network theory; multilayer microwave circuit interconnection; multilayered microwave circuit; via hole; Electromagnetic analysis; Electromagnetic modeling; Electromagnetic radiation; Electromagnetic reflection; Frequency; Integrated circuit interconnections; Joining processes; Microwave circuits; Microwave theory and techniques; Nonhomogeneous media;
Conference_Titel :
Millimeter Waves, 2008. GSMM 2008. Global Symposium on
Conference_Location :
Nanjing
Print_ISBN :
978-1-4244-1885-5
Electronic_ISBN :
978-1-4244-1886-2
DOI :
10.1109/GSMM.2008.4534621
