Abstract :
Presents the introductory welcome message from the conference proceedings. May include the conference officers´ congratulations to all involved with the conference event and publication of the proceedings record.
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location :
Bucharest
DOI :
10.1109/SIITME.2014.6966982
