DocumentCode
164636
Title
Foreword
fYear
2014
fDate
23-26 Oct. 2014
Firstpage
1
Lastpage
3
Abstract
Presents the introductory welcome message from the conference proceedings. May include the conference officers´ congratulations to all involved with the conference event and publication of the proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6966982
Filename
6966982
Link To Document