DocumentCode
164638
Title
Table of contents
fYear
2014
fDate
23-26 Oct. 2014
Firstpage
1
Lastpage
7
Abstract
The following topics are dealt with: emerging technologies and trends in advanced packaging; power electronics and microsystems packaging; assembly and manufacturing technology; electronic circuit design; electronics simulation and modelling; electronics applications; optoelectronics and advanced communication packaging; and reliability.
Keywords
circuit simulation; electronics packaging; integrated optoelectronics; micromechanical devices; network synthesis; power electronics; reliability; advanced communication packaging; assembly; electronic circuit design; electronics applications; electronics modelling; electronics packaging; electronics simulation; manufacturing technology; microsystems packaging; optoelectronics; power electronics; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6966983
Filename
6966983
Link To Document