Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers

Author

Heyen, J. ; Kerssenbrock, T.V. ; Chernyakov, A. ; Heide, P. ; Jacob, A.F.

Author_Institution

Inst. fur Hochfrequenztech., Technische Univ. Braunschweig, Germany

Volume

2

fYear

2003

Firstpage

1041

Abstract

This paper demonstrates advanced packaging concepts for highly integrated encapsulated millimeter-wave modules. Millimeter-wave monolithic integrated circuits (MIMIC) are flip-chip mounted on top of a LTCC package (low temperature co-fired ceramic). This type of "smart package" can integrate all kinds of passive functions as well as compact interconnections between MIMIC and vertical feedthroughs. The bottom side of this package is connected via a standard ball grid array (BGA) to a low-cost laminate PCB serving as motherboard for multiple LTCC modules. Fabricated LTCC test structures and LTCC test packages provide good performance up to about 30 GHz.

Keywords

MIMIC; ball grid arrays; ceramic packaging; encapsulation; flip-chip devices; microassembling; modules; printed circuit manufacture; transceivers; 30 GHz; BGA modules; LTCC packaging; MIMIC; ball grid arrays; encapsulated millimeter-wave modules; flip-chip mounting; integrated mm-wave transceivers; laminate PCB motherboards; low temperature co-fired ceramic; millimeter-wave monolithic integrated circuits; multiple LTCC modules; smart package passive functions/compact interconnections; vertical feedthroughs; Ceramics; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Laminates; MIMICs; Millimeter wave integrated circuits; Temperature; Testing; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2003 IEEE MTT-S International

Conference_Location

Philadelphia, PA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7695-1

Type

conf

DOI

10.1109/MWSYM.2003.1212547

Filename

1212547