DocumentCode
1647267
Title
Adaptive cache-line size management on 3D integrated microprocessors
Author
Ono, Takatsugu ; Inoue, Koji ; Murakami, Kazuaki
Author_Institution
Dept. of Adv. Inf. Technol., Kyushu Univ., Fukuoka, Japan
fYear
2009
Firstpage
472
Lastpage
475
Abstract
The memory bandwidth can dramatically be improved by means of stacking the main memory (DRAM) on processor cores and connecting them by wide on-chip buses composed of through silicon vias (TSVs). The 3D stacking makes it possible to reduce the cache miss penalty because large amount of data can be transferred from the main memory to the cache at a time. If a large cache line size is employed, we can expect the effect of prefetching. However, it might worsen the system performance if programs do not have enough spatial localities of memory references. To solve this problem, we introduce software-controllable variable line-size cache scheme. In this paper, we apply it to an L1 data cache with 3D stacked DRAM organization. In our evaluation, it is observed that our approach reduces the L1 data cache and stacked DRAM energy consumption up to 75%, compared to a conventional cache.
Keywords
DRAM chips; cache storage; low-power electronics; microprocessor chips; three-dimensional integrated circuits; 3D integrated microprocessors; DRAM; adaptive cache-line size management; memory bandwidth; processor cores; software-controllable variable line-size cache scheme; through silicon vias; Bandwidth; Joining processes; Memory management; Microprocessors; Prefetching; Random access memory; Silicon; Stacking; System performance; Technology management; 3D stacked DRAM; low power; variable line-size;
fLanguage
English
Publisher
ieee
Conference_Titel
SoC Design Conference (ISOCC), 2009 International
Conference_Location
Busan
Print_ISBN
978-1-4244-5034-3
Electronic_ISBN
978-1-4244-5035-0
Type
conf
DOI
10.1109/SOCDC.2009.5423920
Filename
5423920
Link To Document