DocumentCode :
164744
Title :
The effect of NaCl on water condensation and electrochemical migration
Author :
Medgyes, Balint ; Gal, Laszlo ; Szivos, Daniel
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2014
fDate :
23-26 Oct. 2014
Firstpage :
259
Lastpage :
262
Abstract :
The effect of NaCl crystals on water condensation and on electrochemical migration processes (ECM) were investigated in case of different lead bearing and lead-free solder alloys on FR4 substrate during a special Thermal-humidity Bias (THB) test, called dew point test. The dew point test simulated the water condensation process and ECM, which processes were followed by in-situ optically and simultaneously electrically as well. The results showed that NaCl crystals can accelerate the condensation intensity, hence they played role as condensation cores. Furthermore, water droplets have formed locally “water bridges” between adjacent conductor lines. On the other hand, after the dissolution of NaCl crystals the ECM processes were accelerated. Finally precipitates and dendrites were formed resulted in shorts.
Keywords :
condensation; failure analysis; sodium compounds; solders; ECM; FR4 substrate; NaCl crystal effect; THB test; condensation cores; condensation intensity; dew point test; electrochemical migration processes; failure phenomena; lead bearing; lead-free solder alloys; locally water bridges; thermal-humidity bias; water condensation process; water droplets; Conductors; Crystals; Electronic countermeasures; Ions; Lead; Reliability; dew point test; electrochemical migration; water condensation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location :
Bucharest
Type :
conf
DOI :
10.1109/SIITME.2014.6967040
Filename :
6967040
Link To Document :
بازگشت