• DocumentCode
    164744
  • Title

    The effect of NaCl on water condensation and electrochemical migration

  • Author

    Medgyes, Balint ; Gal, Laszlo ; Szivos, Daniel

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2014
  • fDate
    23-26 Oct. 2014
  • Firstpage
    259
  • Lastpage
    262
  • Abstract
    The effect of NaCl crystals on water condensation and on electrochemical migration processes (ECM) were investigated in case of different lead bearing and lead-free solder alloys on FR4 substrate during a special Thermal-humidity Bias (THB) test, called dew point test. The dew point test simulated the water condensation process and ECM, which processes were followed by in-situ optically and simultaneously electrically as well. The results showed that NaCl crystals can accelerate the condensation intensity, hence they played role as condensation cores. Furthermore, water droplets have formed locally “water bridges” between adjacent conductor lines. On the other hand, after the dissolution of NaCl crystals the ECM processes were accelerated. Finally precipitates and dendrites were formed resulted in shorts.
  • Keywords
    condensation; failure analysis; sodium compounds; solders; ECM; FR4 substrate; NaCl crystal effect; THB test; condensation cores; condensation intensity; dew point test; electrochemical migration processes; failure phenomena; lead bearing; lead-free solder alloys; locally water bridges; thermal-humidity bias; water condensation process; water droplets; Conductors; Crystals; Electronic countermeasures; Ions; Lead; Reliability; dew point test; electrochemical migration; water condensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/SIITME.2014.6967040
  • Filename
    6967040