Title :
Failure modes and effects analysis (FMEA) system deployment in a semiconductor manufacturing environment
Author :
Whitcomb, Rick ; Rioux, Mark
Author_Institution :
Nat. Semicond. Corp., South Portland, ME, USA
Abstract :
Failure Modes and Effects Analysis (FMEA) is a systematic, learning retention vehicle originally developed by Ford Motor Company in the 1970s to aid the engineer in assessing potential failure modes and design in risk prevention measures for the automotive industry. This same approach can be applied, in much the same fashion, to the semiconductor manufacturing industry and result in retained learnings and a ranked priority of fab and die yield improvement activities. The FMEA system, as it is being applied to a National Semiconductor fab consists of a series of information templates that properly documents relevant information for each major processing step of each major process technology. This paper describes this FMEA system as it has been modified for use by National Semiconductor. The FMEA information template is detailed and the development and implementation approach on several of National Semiconductors major process technology flows is reviewed. The fit of the FMEA tool in the total process control scheme is discussed. In addition, specific examples of completed FMEAs for specific fabrication processing steps are presented along with actions taken to minimize calculated risk factors
Keywords :
integrated circuit manufacture; FMEA system; National Semiconductor fab line; fabrication processing steps; failure modes/effects analysis system; information templates; learning retention; ranked priority; risk prevention measures; semiconductor manufacturing environment; total process control scheme; yield improvement activities; Assembly; Automotive engineering; Cause effect analysis; Fabrication; Failure analysis; Manufacturing industries; Manufacturing processes; Pareto analysis; Semiconductor device manufacture; Testing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
DOI :
10.1109/ASMC.1994.588224