• DocumentCode
    1649669
  • Title

    Stable and Compact Inductance Modeling of 3-D Interconnect Structures

  • Author

    Li, Hong ; Balakrishnan, Venkataramanan ; Koh, Cheng-Kok

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Recent successful techniques for the efficient simulation of large-scale interconnect models rely on the sparsification of the inverse of the inductance matrix L. While there are several techniques for sparsifying L-1, the stability of these approximations for general interconnect structures has not been established, i.e., the sparsified reluctance and inductance matrices are not guaranteed to be positive-definite. In this paper, we present a novel technique for reluctance sparsification for general interconnect structures that enjoys several advantages: first, the resulting sparse approximation is guaranteed to be positive definite; second, the approximation is optimal, in a certain well-defined sense; third, owing to its computational efficiency and numerical stability, the algorithm is applicable for very large problem sizes; and finally our approach yields a compact representation of both inductance and reluctance matrices for general cases
  • Keywords
    approximation theory; inductance; multiprocessor interconnection networks; sparse matrices; stability; 3D interconnect structure; compact inductance modeling; inductance matrix; interconnect model; numerical stability; reluctance matrix; reluctance sparsification; sparse approximation; sparsified reluctance; Circuit simulation; Computational efficiency; Computational modeling; Equivalent circuits; Inductance; Integrated circuit interconnections; Numerical stability; Sparse matrices; Very large scale integration; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    1-59593-389-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2006.320097
  • Filename
    4110145