DocumentCode
1649950
Title
Practical Variation-Aware Interconnect Delay and Slew Analysis for Statistical Timing Verification
Author
Xiaoji Ye ; Peng Li ; Liu, F.
Author_Institution
Dept. of ECE, Texas A&M Univ., College Station, TX
fYear
2006
Firstpage
54
Lastpage
59
Abstract
Interconnects constitute a dominant source of circuit delay for modern chip designs. The variations of critical dimensions in modern VLSI technologies lead to variability in interconnect performance that must be fully accounted for in timing verification. However, handling a multitude of inter-die/intra-die variations and assessing their impacts on circuit performance can dramatically complicate the timing analysis. In this paper, a practical interconnect delay and slew analysis technique is presented to facilitate efficient evaluation of wire performance variability. By harnessing a collection of computationally efficient procedures and closed-form formulas, process and input signal variations are directly mapped into the variability of the output delay and slew. Since our approach produces delay and slew expressions parameterized in the underlying process variations, it can be harnessed to enable statistical timing analysis while considering important statistical correlations. Our experimental results have indicated that the presented analysis is accurate regardless of location of sink nodes and it is also robust over a wide range of process variations
Keywords
delay circuits; statistical analysis; timing circuits; circuit delay; closed-form formula; process variation; signal variation; slew analysis; statistical correlation; statistical timing analysis; statistical timing verification; variation-aware interconnect delay; wire performance variability; Chip scale packaging; Circuit optimization; Delay; Integrated circuit interconnections; Performance analysis; Robustness; Signal processing; Timing; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
1-59593-389-1
Type
conf
DOI
10.1109/ICCAD.2006.320133
Filename
4110153
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