Title :
2005 IEEE International Reliability Physics Symposium. Proceedings 43rd Annual (IEEE Cat. No. 05CH37616)
Abstract :
The following topics are dealt with: IC reliability; semiconductor device reliability; IC interconnects; high-k dielectrics; ESD; latchup; semiconductor memories; soft errors; MOSFETs; failure analysis; MEMS; product reliability; circuit reliability; process integration reliability; wide bandgap devices; compound devices; BEOL dielectrics; assembly; packaging; high voltage devices.
Keywords :
MOSFET; assembling; circuit reliability; dielectric thin films; electronics packaging; electrostatic discharge; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated memory circuits; micromechanical devices; power semiconductor devices; semiconductor device reliability; wide band gap semiconductors; BEOL dielectrics; ESD; IC interconnects; IC reliability; MEMS; MOSFET; assembly; circuit reliability; compound devices; failure analysis; high voltage devices; high-k dielectrics; latchup; packaging; process integration reliability; product reliability; reliability physics; semiconductor device reliability; semiconductor memories; soft errors; wide bandgap devices;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493045
