DocumentCode :
1650282
Title :
Investigating the effects of Inverted Temperature Dependence (ITD) on clock distribution networks
Author :
Sassone, Alessandro ; Calimera, Andrea ; Macii, Alberto ; Macii, Enrico ; Poncino, Massimo ; Goldman, Rich ; Melikyan, Vazgen ; Babayan, Eduard ; Rinaudo, Salvatore
Author_Institution :
Politec. di Torino, Turin, Italy
fYear :
2012
Firstpage :
165
Lastpage :
166
Abstract :
The aggressive scaling of CMOS technology toward nanometer lengths contributed to the surfacing of many effects that were not appreciable at the micrometer regime. Among them, Inverted Temperature Dependence (ITD) is certainly the most unusual. It manifests itself as a speed up of CMOS gates when the temperature increases, resulting in a reversal of the worst-case condition, i.e., CMOS gates show the largest delay at low temperatures. On the other hand, for metal interconnects an high temperature still holds as worst case condition. The two contrasting behaviors may invalidate the results obtained through standard design flow which do not consider temperature as an explicit variable in their optimizations. In this paper we focus on the impact of ITD on clock distribution networks (CDN), whose function is vital to guarantee the synchronization among physically spaced sequential components of digital circuits. Using our simulation framework, we characterized the thermal behavior of a clock tree mapped onto an industrial 65nm CMOS technology and obtained using a standard synthesis tool. Results demonstrate the presence of ITD at low operating voltages and open new potential research scenarios into the EDA field.
Keywords :
CMOS digital integrated circuits; clock distribution networks; clocks; synchronisation; CMOS gates; CMOS technology; EDA field; clock distribution networks; clock tree; digital circuits; inverted temperature dependence effect; metal interconnects; physically spaced sequential components; size 65 nm; standard design flow; synchronization; thermal behavior; CMOS integrated circuits; Clocks; Delay; Integrated circuit interconnections; Integrated circuit modeling; Synchronization; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
Conference_Location :
Dresden
ISSN :
1530-1591
Print_ISBN :
978-1-4577-2145-8
Type :
conf
DOI :
10.1109/DATE.2012.6176453
Filename :
6176453
Link To Document :
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