1650320

Stress migration and the mechanical properties of copper

Alers, Glenn B. ; Sukamto, J. ; Woytowitz, P. ; Lu, X. ; Kailasam, S. ; Reid, J.

Novellus Syst. Inc., San Jose, CA, USA

2005

36

40

copper; electroplating; integrated circuit interconnections; stress effects; tensile strength; copper thickness; dual damascene copper interconnects; elastic versus plastic energy dissipation; mechanical properties; plating chemistry; stress migration; tensile stress; Annealing; Argon; Chemistry; Copper; Dielectrics; Kelvin; Mechanical factors; Tensile stress; Testing; Thermal stresses;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493058

1493058