• DocumentCode
    1650366
  • Title

    A Revisit to Floorplan Optimization by Lagrangian Relaxation

  • Author

    Lin, Chuan ; Zhou, Hai ; Chu, Chris

  • Author_Institution
    Magma Design Autom., Santa Clara, CA
  • fYear
    2006
  • Firstpage
    164
  • Lastpage
    171
  • Abstract
    With the advent of deep sub-micron (DSM) era, floorplanning has become increasingly important in physical design process. In this paper we clarify a misunderstanding in using Lagrangian relaxation for the minimum area floorplanning problem. We show that the problem is not convex and its optimal solution cannot be obtained by solving its Lagrangian dual problem. We then propose a modified convex formulation and solve it using min-cost flow technique and trust region method. Experimental results under module aspect ratio bound [0.5, 2.0] show that the running time of our floorplanner scales well with the problem size in MCNC benchmark. Compared with the floorplanner in the work of Young et al. (2001), our floorplanner is 9.5times faster for the largest case "ami49". It also generates a floorplan with smaller deadspace for almost all test cases. In addition, since the generated floorplan has an aspect ratio closer to 1, it is more friendly to packaging. Our floorplanner is also amicable to including interconnect cost and other physical design metrics
  • Keywords
    circuit layout; circuit optimisation; relaxation theory; Lagrangian relaxation; convex formulation; deep submicron; floorplan optimization; min-cost flow technique; physical design metrics; physical design process; trust region; Benchmark testing; Binary trees; Design automation; Design optimization; Integrated circuit interconnections; Lagrangian functions; Packaging; Permission; Process design; Shape; Floorplan; Lagrangian relaxation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design, 2006. ICCAD '06. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    1-59593-389-1
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2006.320081
  • Filename
    4110169