DocumentCode
1651534
Title
Factors that influence ionic migration on printed wiring boards
Author
Reid, M. ; Punch, J. ; Rodgers, B. ; Pomeroy, M.J. ; Galkin, T. ; Stenberg, T. ; Rusanen, O. ; Elonen, E. ; Vilèn, M. ; Väkeväinen, K.
Author_Institution
Stokes Res. Inst., Limerick Univ., Ireland
fYear
2005
Firstpage
300
Lastpage
304
Keywords
X-ray chemical analysis; condensation; electrodeposition; electromigration; environmental testing; humidity; moisture; optical microscopy; printed circuit testing; scanning electron microscopy; 20 to 35 degC; 21 day; 21 hr; 5 V; Cu; EDS; PWB ionic migration; SEM; aqueous electrolyte; biased metal ion transport; cathode deposition; cyclic tests; dendrite-like deposits; dendritic growth in-situ monitoring; energy dispersive X-ray analysis; environmental testing; moisture condensation; optical microscopy; printed wiring boards; relative humidity; scanning electron microscopy; short circuit; water droplet tests; Anodes; Cathodes; Circuit testing; Electrodes; Humidity; Moisture; Optical microscopy; Scanning electron microscopy; Temperature; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493102
Filename
1493102
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