• DocumentCode
    1652026
  • Title

    Design issues and possible solutions for low-cost and high-efficiency LSIs

  • Author

    Mizuno, Masayuki

  • Author_Institution
    Device Platforms Res. Labs., NEC Corp., Kanagawa, Japan
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Large scale integration with advanced CMOS technologies has been reducing cost, but maintaining chip dependability is becoming more and more difficult. This is due to increasing complexity of system design and increasing uncertainty of signal timing and level. Chip dependability can be realized at low cost and maintain high efficiency by combining technologies of (A) ¿Never produce defects¿ during chip design and manufacturing, (B) ¿Never let defects escape¿ during chip testing, and (C) ¿Never let defects lead to failure¿ during operations, as shown in Fig. 1.
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit testing; large scale integration; CMOS technologies; chip testing; high-efficiency LSI; low-cost LSI; signal timing; CMOS technology; Chip scale packaging; Circuit testing; Costs; Flexible manufacturing systems; Large scale integration; Logic design; Logic testing; Network-on-a-chip; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2009 IEEE International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4244-5639-0
  • Electronic_ISBN
    978-1-4244-5640-6
  • Type

    conf

  • DOI
    10.1109/IEDM.2009.5424327
  • Filename
    5424327