DocumentCode
1652026
Title
Design issues and possible solutions for low-cost and high-efficiency LSIs
Author
Mizuno, Masayuki
Author_Institution
Device Platforms Res. Labs., NEC Corp., Kanagawa, Japan
fYear
2009
Firstpage
1
Lastpage
1
Abstract
Large scale integration with advanced CMOS technologies has been reducing cost, but maintaining chip dependability is becoming more and more difficult. This is due to increasing complexity of system design and increasing uncertainty of signal timing and level. Chip dependability can be realized at low cost and maintain high efficiency by combining technologies of (A) ¿Never produce defects¿ during chip design and manufacturing, (B) ¿Never let defects escape¿ during chip testing, and (C) ¿Never let defects lead to failure¿ during operations, as shown in Fig. 1.
Keywords
CMOS integrated circuits; integrated circuit design; integrated circuit testing; large scale integration; CMOS technologies; chip testing; high-efficiency LSI; low-cost LSI; signal timing; CMOS technology; Chip scale packaging; Circuit testing; Costs; Flexible manufacturing systems; Large scale integration; Logic design; Logic testing; Network-on-a-chip; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location
Baltimore, MD
Print_ISBN
978-1-4244-5639-0
Electronic_ISBN
978-1-4244-5640-6
Type
conf
DOI
10.1109/IEDM.2009.5424327
Filename
5424327
Link To Document