DocumentCode
1652077
Title
Design challenges for 22nm CMOS and beyond
Author
Borkar, Shekhar
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
2009
Firstpage
1
Lastpage
1
Abstract
This paper presents technology and economic challenges posed by 22 nm CMOS and beyond. They can be addressed by advances in design technology, methodology, validation, and testing, to continue to enjoy the benefits of CMOS scaling in the future, as we have over the past decades.
Keywords
CMOS integrated circuits; electronic design automation; integrated circuit design; CMOS scaling; automated design methodology; economic challenges; integrated circuit design; size 22 nm; CMOS technology; Cost function; Degradation; Design methodology; Design optimization; Hardware; Manufacturing; Paper technology; Power generation economics; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location
Baltimore, MD
Print_ISBN
978-1-4244-5639-0
Electronic_ISBN
978-1-4244-5640-6
Type
conf
DOI
10.1109/IEDM.2009.5424329
Filename
5424329
Link To Document