Title :
Testing to eliminate reliability defects from electronic packages
Author_Institution :
Endicott Interconnect Technol., NY, USA
Keywords :
circuit reliability; electronics packaging; printed circuit testing; test equipment; LATEST tester; PCB testing; PWB tester; electronic package reliability defects; flexible circuits; intermittent defects; multilayer ceramic circuits; printed circuits; Application software; Circuit testing; Electronic equipment testing; Electronics packaging; Flexible printed circuits; Inspection; Integrated circuit interconnections; Production; System testing; Wiring;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493129
