• DocumentCode
    1652221
  • Title

    Ti-capping technique as a breakthrough for achieving low threshold voltage, high mobility, and high reliability of pMOSFET with metal gate and high-k dielectrics technologies

  • Author

    Takahashi, Haruhiko ; Minakata, Hiroshi ; Morisaki, Yusuke ; Xiao, Shiqin ; Nakabayashi, Masaaki ; Nishigaya, Keita ; Sakoda, Tsunehisa ; Ikeda, Kazuto ; Morioka, Hiroshi ; Tamura, Naoyoshi ; Kase, Masataka ; Nara, Yasuo

  • Author_Institution
    Fujitsu Microelectron. Ltd., Kuwanashi, Japan
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We have proposed inhibition mechanism of common Al-capping technique for pMOSFET threshold-voltage (Vth) control for the first time, and have established effective Ti-capping technique using metal gate and Hf-based high-k dielectrics. Ti-capping technique can adjust lower Vth than Al-capping one due to the suppression of counter dipole and solid solubility limit in doping. Moreover, Ti-capping technique can improve carrier mobility and negative bias temperature instability (NBTI). We have confirmed that Ti-doped devices achieve higher performance, and the technique is suitable for 32 nm-technology node and beyond.
  • Keywords
    MOSFET; carrier mobility; high-k dielectric thin films; semiconductor device reliability; Ti-capping technique; carrier mobility; counter dipole; dielectrics technologies; high mobility; high reliability; high-k dielectrics; inhibition mechanism; low threshold voltage; metal gate; negative bias temperature instability; pMOSFET; solid solubility; Aluminum oxide; Annealing; Counting circuits; Degradation; Dielectric materials; Hafnium; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2009 IEEE International
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-4244-5639-0
  • Electronic_ISBN
    978-1-4244-5640-6
  • Type

    conf

  • DOI
    10.1109/IEDM.2009.5424332
  • Filename
    5424332