DocumentCode
1652403
Title
Identification of new mechanism of epoxy underfill void formation in electronic packages
Author
Dal, Sheila Liza B ; Zamora, Nova T.
Author_Institution
Intel Technol. Philippines Inc., Cavite, Philippines
fYear
2005
Firstpage
508
Lastpage
512
Keywords
density measurement; differential scanning calorimetry; encapsulation; integrated circuit packaging; microassembling; polymers; voids (solid); DSC; TGA; assembly heating processes; deflux process; differential scanning calorimetry; electronic packages; epoxy underfill void formation; epoxy-amine underfill system; flux decomposition product; flux residues; package assembly; residual chip attach flux; thermal gravimetric analysis; void formation mechanism; Assembly systems; Calorimetry; Cause effect analysis; Electronic packaging thermal management; Electronics packaging; Heating; Material properties; Moisture; Polymers; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493137
Filename
1493137
Link To Document