• DocumentCode
    1652467
  • Title

    A study of electromigration failure in PB-free solder joints

  • Author

    Ding, Min ; Wang, Guotao ; Chao, Brook ; Ho, Paul S. ; Su, Peng ; Uehling, Trent ; Wontor, David

  • Author_Institution
    Microelectron. Res. Center, Texas Univ., Austin, TX, USA
  • fYear
    2005
  • Firstpage
    518
  • Lastpage
    523
  • Keywords
    X-ray chemical analysis; copper; dissolving; electromigration; failure analysis; flip-chip devices; integrated circuit metallisation; integrated circuit reliability; nickel; scanning electron microscopy; silver alloys; solders; tin alloys; 0.64 to 0.72 eV; 1.03 to 1.11 eV; Cu3Sn-Cu6Sn5; EDX; EM reliability; SEM; SnAg-Cu; SnAg-Ni; UBM dissolution; activation energy; diffusivity; electromigration failure; electromigration lifetime; electron current flow; energy-dispersive X-ray spectroscopy; failure analysis; flip-chip solder bumps; lead-free solder joints; solder bumps; solder cracking; solder de-wetting; temperature dependent failure mechanisms; under bump metallization; under bump metallurgy; Artificial intelligence; Current density; Electromigration; Failure analysis; Metallization; Scanning electron microscopy; Soldering; Stress; Temperature; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493139
  • Filename
    1493139
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1652467