Statistical thermal modeling and optimization considering leakage power variations

Unaddressed thermal issues can seriously hinder the development of reliable and low power systems. In this paper, we propose a statistical approach for analyzing thermal behavior under leakage power variations stemming from the manufacturing process. Based on the proposed models, we develop floorplanning techniques targeting thermal optimization. The experimental results show that peak temperature is reduced by up to 8.8°C, while thermal-induced leakage power and maximum thermal variance are reduced by 13% and 17%, respectively, with no additional area overhead compared with best performance-driven optimized design.