1652875

Fast reliability evaluation of backend dielectrics using lifetime prediction techniques at wafer level

Hong, Changsoo ; Milor, Linda ; Lin, M.Z. ; Hsu, W.M. ; Peng, Yeng

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

2005

588

589

correlation methods; dielectric materials; leakage currents; life testing; semiconductor device breakdown; semiconductor device reliability; accelerated life testing; backend dielectrics; breakdown signature parameters; device lifetime prediction techniques; homogeneous correlation technique; near-time-zero leakage current data; ramped voltage stress test; reliability evaluation; time dependent dielectric breakdown test; wafer level; Computer aided manufacturing; Current measurement; Dielectric measurements; Electric breakdown; Fabrication; Leakage current; Life testing; Stress; Temperature; Voltage;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493156

1493156